| PART |
Description |
Maker |
| MPC603EFE100LX MPC603EFE133LX MPC603EEC |
MPC603e RISC Microprocessor Family PID6-603e Hardware Specification Advance Information
32-BIT, 133 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 100 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
|
Motorola Mobility Holdings, Inc.
|
| C450UT190-0319-30 C460UT190-0319-30 C450UT190-0318 |
Small Chip 190 x 190 x 85 Single Wire Bond Structure
Cree UltraThin Gen III LEDs
Small Chip 190 x 190 x 85 Single Wire Bond Structure
|
Cree, Inc
Marktech Corporate
|
| ATCWBR14701FGEW |
Wire Bond Resistors
|
List of Unclassifed Manufac...
|
| TT320N16SOF |
Solder-Bond Technology
|
Infineon Technologies A...
|
| TT190N16SOF |
Solder-Bond Technology
|
Infineon Technologies A...
|
| CR16AU-103KV CR16AU-103NV CR16AU-103FB CR16AU-103M |
Wire-bond Purpose Chip Resistor
|
HOKURIKU ELECTRIC INDUSTRY CO.,LTD
HOKURIKU ELECTRIC INDUS...
|
| MA4BPS201 MA4BPS301 MA4BPS101 |
PIN Diode Chips with Offset Bond Pads
|
MACOM[Tyco Electronics]
|
| MPE603EFE100LX |
32-BIT, 100 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
|
Motorola Mobility Holdings, Inc.
|
| SML-LX19012UWC-WB7 |
7W, WIRELESS BOND LED MODULE
|
LUMEX INC.
|
